TUSB216 datasheet(4/33 Pages) TI

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6 Pin Configuration and Functions

SDA

SCL/CD

RSTN

BOOST

D2P

D2M

RX_SEN/ENA_HS

GND

CDP_ENZ

VCC

D1M

D1P

Not to scale

Figure 6-1. TUSB216-Q1 RWB 12-Pin X2QFN Top View

Table 6-1. Pin Functions

I/O

INTERNAL

PULLUP/PULLDOWN

DESCRIPTION

NAME

NO.

BOOST

N/A

USB High-speed boost select via external pull down resistor.

Both edge boost and DC boost are controlled by a single pin in non-

I2C mode. In I2C mode edge boost and DC boost can be individually

controlled.

Sampled upon power up. Does not recognize real time adjustments.

Auto selects BOOST LEVEL = 3 when left floating.

CDP_ENZ

500 kΩ PU

Set CDP_ENZ is low to enable BC 1.2 CDP controller

RX_SEN2/ENA_HS

I/O

N/A

In I2C mode:

Reserved for TI test purpose.

In non-I2C mode:

At reset: 3-level input signal RX_SEN. USB High-speed RX

Sensitivity Setting to Compensate ISI Jitter

H (pin is pulled high) – high RX sensitivity (high loss channel)

M (pin is left floating) – medium RX sensitivity (medium loss channel)

L (pin is pulled low) – low RX sensitivity (low loss channel)

After reset: Output signal ENA_HS. Flag indicating that channel is in

High-speed mode. Asserted upon:

1. Detection of USB-IF High-speed test fixture from an unconnected

state followed by transmission of USB TEST_PACKET pattern.

2. Squelch detection following USB reset with a successful HS

handshake [HS handshake is declared to be successful after single

chirp J chirp K pair where each chirp is within 18 μs – 128 μs].

D2P

I/O

N/A

USB High-speed positive port.

TUSB216-Q1

SLLSF03A – APRIL 2019 – REVISED SEPTEMBER 2021

www.ti.com

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