PRODUCT SPECIFICATION

Part

Number

USB4105

Rev

A1

Date

24/10/19

Product

Description

USB Type C Receptacle for USB2.0 ,SMT Type, PCB Top Mount

Page

6 

Doc

Number

USB Type C

Prepared

CC

Checked

VJ

Approved

PH

 

 

 

 

www.gct.co

 

7.0 RESISTANCE TO INFRARED REFLOW SOLDERING HEAT

Parameter

Reference

Specification

Average temperature gradient in

 

preheating

 

2.5°C/s

Soak time

2-3 minutes

Time above 217°C

60

Time above 230°C

50

Time above 250°C

5

Peak temperature in reflow

255°C(–0/+5°C)

Temperature gradient in cooling

 

-5°C/s max

Lead Free Process

 

This profile is the minimum requirement for evaluating soldering heat resistance of components. Heat

transfer method used for reflow soldering is hot air convection. The actual air temperatures used to

achieve the specified profile is higher and largely dependent on the reflow equipment.