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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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MPC8544EBVTALFA датащи(PDF) 82 Page - NXP Semiconductors |
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MPC8544EBVTALFA датащи(HTML) 82 Page - NXP Semiconductors |
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82 / 117 page  MPC8544E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 8 82 Freescale Semiconductor Package Description 18.2 Mechanical Dimensions of the MPC8544E FC-PBGA Figure 59 shows the mechanical dimensions and bottom surface nomenclature of the MPC8544E, 783 FC-PBGA package without a lid. Figure 59. Mechanical Dimensions and Bottom Surface Nomenclature of the MPC8544E FC-PBGA without a Lid Notes: 1. All dimensions are in millimeters. 2. Dimensions and tolerances per ASME Y14.5M-1994. 3. Maximum solder ball diameter measured parallel to datum A. 4. Datum A, the seating plane, is determined by the spherical crowns of the solder balls. 5. Parallelism measurement shall exclude any effect of mark on top surface of package. 6. Capacitors may not be present on all parts. Care must be taken not to short exposed metal capacitor pads. 7. All dimensions are symmetric across the package center lines, unless dimensioned otherwise. |
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