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MSCSM170AM15CT3AG датащи(PDF) 2 Page - Microchip Technology |
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MSCSM170AM15CT3AG датащи(HTML) 2 Page - Microchip Technology |
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2 / 17 page ![]() Features The following are the key features of MSCSM170AM15CT3AG device: • SiC Power MOSFET – High speed switching – Low RDS(on) – Ultra low loss • SiC Schottky Diode – Zero reverse recovery – Zero forward recovery – Temperature independent switching behavior – Positive temperature coefficient on VF • Low stray inductance • Kelvin source for easy drive • Internal thermistor for temperature monitoring • Aluminum Nitride (AlN) substrate for improved thermal performance Benefits The following are the benefits of MSCSM170AM15CT3AG device: • High efficiency converter • Outstanding performance at high frequency operation • Direct mounting to heatsink (isolated package) • Low junction-to-case thermal resistance • Solderable terminals both for power and signal for easy PCB mounting • Low profile • RoHS compliant Applications The following are the applications of MSCSM170AM15CT3AG device: • Induction heating and welding • Solar inverter • EV motor and traction drive MSCSM170AM15CT3AG © 2021 Microchip Technology Inc. Datasheet DS00003932A-page 2 |
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