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MSCSM170AM058CD3AG датащи(PDF) 2 Page - Microchip Technology |
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MSCSM170AM058CD3AG датащи(HTML) 2 Page - Microchip Technology |
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2 / 16 page ![]() Features The following are the key features of MSCSM170AM058CD3AG device: • SiC Power MOSFET – Low RDS(on) – High temperature performance • SiC Schottky Diode – Zero reverse recovery – Zero forward recovery – Temperature Independent switching behavior – Positive temperature coefficient on VF • Kelvin emitter for easy drive • High level of integration • M6 power connectors • Aluminum Nitride (AlN) substrate for improved thermal performance Benefits The following are the benefits of MSCSM170AM058CD3AG device: • High efficiency converter • Stable temperature behavior • Direct mounting to heatsink (isolated package) • Low junction-to-case thermal resistance • RoHS Compliant Applications The following are the applications of MSCSM170AM058CD3AG device: • Welding converters • Switched mode power supplies • Uninterruptible power supplies • EV motor and traction drive MSCSM170AM058CD3AG © 2021 Microchip Technology Inc. Datasheet DS00003977A-page 2 |
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