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DA7280 датащи(PDF) 13 Page - Dialog Semiconductor |
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DA7280 датащи(HTML) 13 Page - Dialog Semiconductor |
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13 / 76 page ![]() DA7280 LRA/ERM Haptic Driver with Multiple Input Triggers, Integrated Waveform Memory and Wideband Support Datasheet Revision 3.0 30-Jul-2019 CFR0011-120-00 13 of 76 © 2019 Dialog Semiconductor 4.5 Thermal Characteristics Table 10: WLCSP Thermal Ratings Parameter Description (Note 1) Min Typ Max Unit RƟJA Junction-to-ambient thermal resistance 90.3 °C/W RƟJC_TOP Junction-to-case (top) thermal resistance 43.6 °C/W RƟJB Junction-to-board thermal resistance 49.0 °C/W JT Junction-to-top characterization parameter 6.4 °C/W JB Junction-to-board characterization parameter 45.8 °C/W Note 1 Multilayer JEDEC standard, still air, ambient temperature 25 °C, simulated value. Table 11: QFN Thermal Ratings Parameter Description (Note 1) Min Typ Max Unit RƟJA Junction-to-ambient thermal resistance 88.2 °C/W RƟJC_TOP Junction-to-case (top) thermal resistance 54.6 °C/W RƟJB Junction-to-board thermal resistance 39.3 °C/W JT Junction-to-top characterization parameter 3.4 °C/W JB Junction-to-board characterization parameter 50.0 °C/W RƟJC_BOTTOM Junction-to-case (bottom) thermal resistance 4.4 °C/W Note 1 Multilayer JEDEC standard, still air, ambient temperature 25 °C, simulated value. |
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