under the QFN package using any method they deem appropriate. Any design should be subject to system validation

and qualification prior to commitment to mass production of field deployment. Use a 5 mil stencil.

4.4

Recommended Solder Reflow Information

RoHS 6/6

Pb-free 100% Matte Tin Finish

Package Peak Temperature for Solder Reflow (40 s maximum exposure)—260 °C (0 °C, –5 °C)

Table 4-3. Classification Reflow Profiles

Profile Feature

Sn-Pb Eutectic Assembly

Pb-Free Assembly

3 °C/second max

3 °C/second max

Preheat

100 °C

150 °C

150 °C

200 °C

60 s to 120 s

60 s to 180 s

Time Maintained

183 °C

217 °C

60 s to 150 s

60 s to 150 s

Peak classification temperature (TP)

210 °C to 235 °C

240 °C to 255 °C

Time within 5 °C of actual peak temperature

(tp)

10 s to 30 s

20 s to 40 s

Ramp-down rate

6 °C/second max

6 °C/second max

Time 25 °C to peak temperature

6 minutes max

8 minutes max

Figure 4-5. Classification Reflow Profiles

Table 4-4. Pb-Free Process—Package Classification Reflow Temperatures

Package Thickness

260 + 0 °C

260 + 0 °C

260 + 0 °C

PD39210

Package Information

Datasheet

DS00003554C-page 15