HMC8191LC4TR-R5 datasheet(5/44 Pages) AD

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Data Sheet

HMC8191

Rev. C | Page 5 of 44

PIN CONFIGURATION AND FUNCTION DESCRIPTIONS

GND

PACKAGE

BASE

14 GND

15 GND

16 RF

17 GND

18 GND

HMC8191

TOP VIEW

(Not to Scale)

NOTES

1. NC = NO CONNECT. THESE PINS MAY BE CONNECTED TO

RF/DC GROUND WITHOUT AFFECTING PERFORMANCE.

2. EXPOSED PAD. THE EXPOSED PAD MUST BE CONNECTED

TO RF/DC GROUND.

Figure 2. Pin Configuration

Table 4. Pin Function Descriptions

Pin No.

Mnemonic

Description

1 to 6, 13 to 15, 17 to 22

GND

Ground. These pins and the package bottom must be connected to RF/dc ground. See Figure 3 for

the interface schematic.

7 to 9, 11, 24

No Connect. These pins can be connected to RF/dc ground without affecting performance.

10, 12

IF1, IF2

First and Second Quadrature Intermediate Frequency Input/Output Pins. These pins are dc-coupled.

For applications not requiring operation to dc, use an off-chip dc blocking capacitor. For operations

to dc, these pins must not source/sink more than 3 mA of current; otherwise, the device may not

function and may fail. See Figure 4 for the interface schematic.

Radio Frequency Input/Output. This pin is dc-coupled and matched to 50 Ω when the LO is turned

on. See Figure 5 for the interface schematic.

Local Oscillator Input. This pin is dc-coupled and matched to 50 Ω when the LO is turned on. See

Figure 6 for the interface schematic.

EPAD

Exposed Pad. The exposed pad must be connected to RF/dc ground.

INTERFACE SCHEMATICS

GND

Figure 3. GND Interface Schematic

IF1, IF2

Figure 4. IF1 and IF2 Interface Schematic

Figure 5. RF Interface Schematic

Figure 6. LO Interface Schematic

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