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LM4864MM/NOPB датащи(PDF) 16 Page - Texas Instruments

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номер детали LM4864MM/NOPB
подробное описание детали  LM4864 725mW Audio Power Amplifier with Shutdown Mode
PDF  27 Pages
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производитель  TI [Texas Instruments]
домашняя страница  http://www.ti.com
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LM4864MM/NOPB датащи(HTML) 16 Page - Texas Instruments

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LM4864
SNAS109F – SEPTEMBER 1999 – REVISED MAY 2013
www.ti.com
LM4864 MDC MWC
725MW Audio Power Amplifier With Shutdown Mode
Figure 38. Die Layout (B - Step)
Table 1. DIE/WAFER CHARACTERISTICS
Fabrication Attributes
General Die Information
Physical Die Identification
LM4862B
Bond Pad Opening Size (min)
86µm x 86µm
Die Step
B
Bond Pad Metalization
ALUMINUM
Physical Attributes
Passivation
NITRIDE
Wafer Diameter
150mm
Back Side Metal
Bare Back
Dise Size (Drawn)
1283µm x 952µm
Back Side Connection
GND
51mils x 37mils
Thickness
406µm Nominal
Min Pitch
117µm Nominal
Special Assembly Requirements:
Note: Actual die size is rounded to the nearest micron.
Die Bond Pad Coordinate Locations (B - Step)
(Referenced to die center, coordinates in µm) NC = No Connection
X/Y COORDINATES
PAD SIZE
SIGNAL NAME
PAD# NUMBER
X
Y
X
Y
BYPASS
1
-322
523
86
x
86
GND
2
-359
259
86
x
188
INPUT +
3
-359
5
86
x
86
GND
4
-359
-259
86
x
188
NC
5
-323
-523
86
x
86
INPUT -
6
-109
-523
86
x
86
VOUT 1
7
8
-523
86
x
86
VDD
8
358
-78
86
x
188
GND
9
358
141
86
x
188
NC
10
359
406
86
x
86
NC
11
323
523
86
x
86
VOUT 2
12
8
523
86
x
86
SHUTDOWN
13
-109
523
86
x
86
16
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Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM4864



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