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LM4864MM/NOPB датащи(PDF) 12 Page - Texas Instruments |
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LM4864MM/NOPB датащи(HTML) 12 Page - Texas Instruments |
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12 / 27 page ![]() LM4864 SNAS109F – SEPTEMBER 1999 – REVISED MAY 2013 www.ti.com APPLICATION INFORMATION BRIDGE CONFIGURATION EXPLANATION As shown in Figure 1, the LM4864 has two operational amplifiers internally, allowing for a few different amplifier configurations. The first amplifier's gain is externally configurable, while the second amplifier is internally fixed in a unity-gain, inverting configuration. The closed-loop gain of the first amplifier is set by selecting the ratio of RF to Ri while the second amplifier's gain is fixed by the two internal 10kΩ resistors. Figure 1 shows that the output of amplifier one serves as the input to amplifier two which results in both amplifiers producing signals identical in magnitude, but out of phase 180°. Consequently, the differential gain for the IC is AVD = 2*(RF/Ri) (1) By driving the load differentially through outputs Vo1 and Vo2, an amplifier configuration commonly referred to as “bridged mode” is established. Bridged mode operation is different from the classical single-ended amplifier configuration where one side of its load is connected to ground. A bridge amplifier design has a few distinct advantages over the single-ended configuration, as it provides differential drive to the load, thus doubling output swing for a specified supply voltage. Four times the output power is possible as compared to a single-ended amplifier under the same conditions. This increase in attainable output power assumes that the amplifier is not current limited or clipped. In order to choose an amplifier's closed- loop gain without causing excessive clipping, please refer to AUDIO POWER AMPLIFIER DESIGN section. A bridge configuration, such as the one used in LM4864, also creates a second advantage over single-ended amplifiers. Since the differential outputs, Vo1 and Vo2, are biased at half-supply, no net DC voltage exists across the load. This eliminates the need for an output coupling capacitor which is required in a single supply, single- ended amplifier configuration. If an output coupling capacitor is not used in a single-ended configuration, the half- supply bias across the load would result in both increased internal lC power dissipation as well as permanent loudspeaker damage. POWER DISSIPATION Power dissipation is a major concern when designing a successful amplifier, whether the amplifier is bridged or single-ended. Equation 2 states the maximum power dissipation point for a bridge amplifier operating at a given supply voltage and driving a specified output load. PDMAX = (VDD) 2/(2π2R L) Single-Ended (1) (2) However, a direct consequence of the increased power delivered to the load by a bridge amplifier is an increase in internal power dissipation point for a bridge amplifier operating at the same conditions. PDMAX = 4(VDD) 2/(2π2R L) Bridge Mode (2) (3) Since the LM4864 has two operational amplifiers in one package, the maximum internal power dissipation is 4 times that of a single-ended amplifier. Even with this substantial increase in power dissipation, the LM4864 does not require heatsinking. From Equation 2, assuming a 5V power supply and an 8 Ω load, the maximum power dissipation point is 633 mW. The maximum power dissipation point obtained from Equation 3 must not be greater than the power dissipation that results from Equation 4: PDMAX = (TJMAX − TA)/θJA (3) (4) For package DGK0008A, θJA = 210°C/W, for package D00008A, θJA = 170°C/W, for package P0008E, θJA = 107°C/W, and for package NGY0010A, θJA = 63°C/W. TJMAX = 150°C for the LM4864. Depending on the ambient temperature, TA, of the system surroundings, Equation 4 can be used to find the maximum internal power dissipation supported by the IC packaging. If the result of Equation 3 is greater than that of Equation 4, then either the supply voltage must be decreased, the load impedance increased, the ambient temperature reduced, or the θJA reduced with heatsinking. In many cases larger traces near the output, VDD, and GND pins can be used to lower the θJA. The larger areas of copper provide a form of heatsinking allowing a higher power dissipation. For the typical application of a 5V power supply, with an 8 Ω load, the maximum ambient temperature possible without violating the maximum junction temperature is approximately 44°C provided that device operation is around the maximum power dissipation point and assuming surface mount packaging. Internal power dissipation is a function of output power. If typical operation is not around the maximum power dissipation point, the ambient temperature can be increased. Refer to Typical Performance Characteristics for power dissipation information for lower output powers. 12 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM4864 |
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