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FUSB3307 датащи(PDF) 15 Page - ON Semiconductor |
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FUSB3307 датащи(HTML) 15 Page - ON Semiconductor |
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15 / 21 page ![]() FUSB3307 www.onsemi.com 15 USB 2.0 Data Lines The USB 2.0 Data Lines D+ and D− can be externally connected together via a 100 ohms resistor to provide the maximum power, a legacy USB device can take, which is 1.5 A per USB Battery Charging v1.2 (BC1.2) specification. This will usually be the case when a USB−C to micro−B cable is plugged into this design where this adapter cable has the required Sink Rd resistors within it to allow the FUSB3307 to recognize a Type C attach and to source 5 V on VBUS. The Sink will go through BC1.2 steps of primary and secondary detection to detect a Dedicated Charging Port (DCP) via this resistor connection of D+ and D− and takes 1.5 A maximum from VBUS. If selected by the Trim table (Table 6), to attach to certain phones that require resistor dividers on D+ and D− then connect D+ and D− to the FUSB3307 with small (22 W typical) resistors which auto−detects which type of legacy Sink is plugged in and automatically provides the legacy device with the appropriate power level it needs to charge. Note this power level is controlled by the device itself not the power source which is typical of most legacy USB power systems. The FUSB3307 will allow for 5 V at a maximum of 3 A for even legacy devices which will take at most either 1.5 A or 2.4 A for most legacy devices. D+ and D− can also be connected to a USB Physical Layer (PHY) controller for using these lines for data traffic. In that case, the USB PHY is expected to advertise itself as a Charging Downstream Port (CDP) per BC1.2 so that the Sink can take a maximum of 1.5 A of power. D+ and D− are low voltage pins (6 V absolute maximum voltage) and are not expected to be shorted to VBUS when VBUS goes higher than 6 V. The TVS diodes connected to D+ and D− shown in the figure (ESD7104) allow operating voltages up to 5 V for the offline design (Figure 5) and typically D+ and D− are 3.3 V signals when used for USB 2.0 data signals. For the automotive buck−boost design (Figure 6), short−to−VBUS protection is shown via the NIV1241 that contain TVS diodes and FETs to keep the FUSB3307 D+ and D− lines less than 5 V as shown in Figure 13. Figure 13. D+ and D− Pin Protection Provided by the NIV1241 Power Delivery Operation FUSB3307 advertises source capabilities and responds to PD message completely autonomously following the USB PD 3.0 with PPS and Type C specifications. For more details on the USB PD messages please refer to the specification references mentioned below (See Specification References on page 19). Similarly the references mention the Type C and the BC1.2 specifications as well for further information. To allow for a variety of designs, the following table has a number of trim options to accommodate almost every design. The following Table 6 lists out the various options. While all these options exist, they can only be obtained from ON Semiconductor if requested and once delivered, the trim option cannot be changed. The default trim option column below is for a 60 W design that uses 3 A cables and is for a USB Power Delivery (PD) 3.0 design with Programmable Power Supplies (PPS) and Fixed Supplies. In the future more default options will be available for general purpose use with likely 30 W, 45 W and 90 W power levels in addition to the 60 W option. Table 6. FUSE TRIM (NOTE 7) OPTION TABLE # Function Trim Option Default Option 1 Output Power PD Power (PDP) from 16 W to 100 W in 1W increments 60 W 2 Cable Compensation Four choices of 50 mV/A, 100 mV/A, 150 mV/A and Disabled Disabled 3 5 A Power Source 0 = Max current is 3 A, no eMarker detection 1 = Max current is 5 A, eMarker detection needed 0 = Max current = 3 A, no eMarker detection 4 Charging Output OVP Four choices of OVP thresholds: 115%, 120%, 125% and 130% 120% OVP 5 Charging Output UVP Four choices of UVP thresholds: 60%, 65%, 70% and Disabled 65% UVP 6 D+/D− versus PDIV0/PDIV1 00: D+/PDIV1=D+, D−/PDIV0=D− (SOIC package without PDIV2 pin) 01: D+/PDIV1=PDIV1, D−/PDIV0=PDIV0 (SOIC package without PDIV2 pin) 10: D+/PDIV1=PDIV1, D−/PDIV0=PDIV0 PDIV2 standalone pin (QFN package) 11: D+/PDIV1=D+, D−/PDIV0=D− PDIV2 standalone pin (QFN package) 00 for SOIC package 11 for QFN package 7 Support PD 3.0 0 = Enable PD 2.0 1 = Enable PD 3.0 1 = Enable PD 3.0 7. ”Trim Options” means feature programmability to create new functional options in a manufacturing test program by trimming semiconductor fuses. |
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