FUSB251

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5

ABSOLUTE MAXIMUM RATINGS

Symbol

Parameter

Conditions

Min

Typ

Max

Units

Junction Temperature

−40

+150

°C

Storage Temp

−65

+150

°C

VDD

Supply voltage

Slew Rate 2 V/ms (rising), 1 V/ms (falling)

−0.5

12.0

V

VCC

Vccx to GND

−0.5

24

V

VSBU

VSBUx to GND

−0.5

24

V

VCCx_H and

VSBUx_H

VCCX_H, VSBUx_H to GND

−0.5

6.0

V

ICCSW

DC CC switch current

1.25

A

ISBUSW

DC SBU switch current

100

mA

IIK

DC input diode current

−50

mA

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality

should not be assumed, damage may occur and reliability may be affected.

ESD RATINGS − JEDEC / IEC SPECIFICATION

Electro Static Discharge (ESD) Specifications

Condition

Value

Unit

Human Body Model, JEDEC JESD22−A114

CCx and SBUx pins to GND

±5000

V

Other pins

±2000

Charged Device Model, JEDEC JESD22−C101

All pins

±1000

IEC 61000−4−2 System ESD

CCx and SBUx pins to GND

Air−gap Discharge

±15000

Contact Discharge

±8000

IEC 61000−4−5 Lightning and Surge

CCx and SBUx pins to GND

±35

OPERATING CONDITIONS

Symbol

Parameter

Conditions

MIn

Typ

Max

Unit

VDD

Supply Voltage Range

2.7

3.8

5.5

V

Operating Ambient Temperature

−40

+85

°C

Junction Temperature

−40

+125

°C

VCCx,

VCCx_H

CC1 CC2, CC1_H, CC2_H voltage

0

5.5

V

VSBUx,

VSBUx_H

SBU1, SBU2, SBU1_H,

SBU2_H voltage

0

4.2

V

C_CAP

External capacitor capacitance

0.1

1.0

mF

VPU

Pull up resistor power rail of SDA, SCL

and INTB

1.7

VDD

V

ICCSW

CC switch current

mA

ISBU

SBU switch current

50

mA

Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond

the Recommended Operating Ranges limits may affect device reliability.