ADPD1081 datasheet(13/74 Pages) AD

13 / 74 page

Data Sheet

ADPD1080/ADPD1081

Rev. C | Page 13 of 74

ABSOLUTE MAXIMUM RATINGS

Table 8. ADPD1080 Absolute Maximum Rating

Parameter

Rating

AVDD to AGND

−0.3 V to +2.2 V

DVDD to AGND (LFCSP Only)

−0.3 V to +2.2 V

GPIOx to AGND (LFCSP Only)

−0.3 V to +2.2 V

DVDD to DGND (WLCSP Only)

−0.3 V to +2.2 V

GPIOx to DGND (WLCSP Only)

−0.3 V to +2.2 V

LEDXx to LGND

−0.3 V to +3.6 V

SCL, SDA to DGND

−0.3 V to +3.9 V

Junction Temperature

150°C

Electrostatic Discharge (ESD)

Human Body Model (HBM)

1500 V

Charged Device Model (CDM)

500 V

Machine Model (MM)

100 V

Table 9. ADPD1081 Absolute Maximum Rating

Parameter

Rating

VDD to AGND

−0.3 V to +2.2 V

VDD to DGND

−0.3 V to +2.2 V

GPIOx, MOSI, MISO, SCLK, CS to DGND

−0.3 V to +2.2 V

LEDXx to LGND

−0.3 V to +3.6 V

Junction Temperature

150°C

Electrostatic Discharge (ESD)

Human Body Model (HBM)

1500 V

Charged Device Model (CDM)

500 V

Machine Model (MM)

100 V

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the

operational section of this specification is not implied.

Operation beyond the maximum operating conditions for

extended periods may affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Close attention to

PCB thermal design is required.

θJA is the junction to ambient thermal resistance value, and θJC

is the junction to case thermal resistance value.

Table 10. Thermal Resistance

Package Type1

θJA

θJC

Unit

CP-28-5 (28-Lead LFCSP)

54.9

5.3

°C/W

CB-16-18 (16-Ball WLCSP)

0.5

°C/W

CB-17-1 (17-Ball WLCSP)

0.5

°C/W

Thermal impedance simulated values are based on a JEDEC 2S2P board and

2 thermal vias. See JEDEC JESD-51.

RECOMMENDED SOLDERING PROFILE

Figure 5 and Table 11 provide details about the recommended

soldering profile.

25°C TO PEAK

PREHEAT

CRITICAL ZONE

TL TO TP

TIME

RAMP-UP

SMIN

TSMAX

Figure 5. Recommended Soldering Profile

Table 11. Recommended Soldering Profile

Profile Feature

Condition (Pb-Free)

Average Ramp Rate (TL to TP)

3°C/sec max

Preheat

Minimum Temperature (TSMIN)

150°C

Maximum Temperature (TSMAX)

200°C

Time (TSMIN to TSMAX) (tS)

60 sec to 180 sec

TSMAX to TL Ramp-Up Rate

3°C/sec maximum

Time Maintained Above Liquidous

Temperature

Liquidous Temperature (TL)

217°C

Time (tL)

60 sec to 150 sec

Peak Temperature (TP)

+260 (+0/−5)°C

Time Within 5°C of Actual Peak

Temperature (tP)

<30 sec

Ramp-Down Rate

6°C/sec maximum

Time from 25°C to Peak Temperature

8 minutes maximum

ESD CAUTION

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