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TSML200 датащи(PDF) 2 Page - Shanghai Leiditech Electronic Technology Co., Ltd |
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TSML200 датащи(HTML) 2 Page - Shanghai Leiditech Electronic Technology Co., Ltd |
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2 / 2 page ![]() TSML200 Solder Reflow Recommendations B B A Solder Pad Layouts A B C Part number (mm) (mm) (mm) TSML200 0.60 1.10 1.00 * Recommended reflow methods: IR, Vapor phase, hot air oven. * Devices can be cleaned using standard industry methods and solvents. Notes: If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. Devices are not designed to be wave soldered to the bottom side of the board. Package Information Tape & Reel:5000pcs per reel. Effectivity: Reference documents shall be the issue in effect on the date of invitation for bid. Caution: Operation beyond the rated voltage or current may result in rupture electrical arcing or flame. Specifications are subject to change without notice Shanghai Leiditech Electronic Co.,Ltd Email: sale1@leiditech.com Tel : +86- 021 50828806 Fax : +86- 021 50477059 Rev : www.leiditech.com 01.06.2015 2/2 |
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