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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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REF34-Q1 датащи(PDF) 10 Page - Texas Instruments |
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REF34-Q1 датащи(HTML) 10 Page - Texas Instruments |
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10 / 38 page  8 Typical Characteristics (continued) at TA = 25°C, VIN = VEN = 12 V, IL = 0 mA, CL = 10 µF, CIN = 0.1 µF (unless otherwise noted) Thermal Hysteresis - Cycle 1 (ppm) 0 5% 10% 15% 20% 25% 30% DGKt Figure 8-19. Thermal Hysteresis Distribution (Cycle 1) - DGK Package Thermal Hysteresis - Cycle 2 (ppm) 0 5% 10% 15% 20% 25% 30% DGKt Figure 8-20. Thermal Hysteresis Distribution (Cycle 2) - DGK Package Solder Heat Shift (%) 0 10% 20% 30% 40% 50% D017 Refer to Section 9.1 for more information Figure 8-21. Solder Heat Shift Distribution - DBV Package Solder Heat Shift (%) 0 10% 20% 30% 40% 50% DGKs Refer to Section 9.1 for more information Figure 8-22. Solder Heat Shift Distribution - DGK Package 0.5ms/div 1V/div En VOUT D018 Figure 8-23. Turnon Time (Enable) Time 1s/div D08_ Figure 8-24. 0.1-Hz to 10-Hz Noise (VREF) REF34-Q1 SBAS901C – JULY 2018 – REVISED OCTOBER 2020 www.ti.com 10 Submit Document Feedback Copyright © 2020 Texas Instruments Incorporated Product Folder Links: REF34-Q1 |
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