7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

Input voltage

IN

–0.3

13

V

EN

–0.3

IN + 0.3

V

Output voltage

–0.3

5.5

V

Output short circuit current

20

mA

–55

150

°C

–65

170

°C

(1)

Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may

degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond

those specified is not implied. These are stress ratings only and functional operation of the device at these or any other conditions

beyond those specified in the Electrical Characteristics Table is not implied.

7.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

Human-body model (HBM), per AEC Q100-002(1)

±2500

V

Charged-device model (CDM), per AEC

Q100-011

±1500

(1)

AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

IN

Input Voltage

DO

(1)

12

V

EN

Enable Voltage

0

IN

V

Output Current

–10

10

mA

Operating Temperature

–40

25

125

°C

(1)

7.4 Thermal Information

THERMAL METRIC(1)

REF34-Q1

UNIT

DBV

DBV

DGK

5 PINS

6 PINS

8 PINS

Junction-to-ambient thermal resistance

122.6

122.6

174.1

°C/W

Junction-to-case (top) thermal resistance

80.2

80.2

61.3

°C/W

Junction-to-board thermal resistance

42

42

95.5

°C/W

Junction-to-top characterization parameter

23.2

23.2

8.5

°C/W

Junction-to-board characterization parameter

41.9

41.9

93.9

°C/W

Junction-to-case (bottom) thermal resistance

N/A

N/A

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

REF34-Q1

SBAS901C – JULY 2018 – REVISED OCTOBER 2020

www.ti.com

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