HI-SINCERITY

MICROELECTRONICS CORP.

Spec. No. : MOS200406

Issued Date : 2004.10.01

Revised Date : 2005.04.22

Page No. : 3/4

HIRF730, HIRF730F

HSMC Product Specification

TO-220AB Dimension

TO-220FP Dimension

Important Notice:

• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.

• HSMC reserves the right to make changes to its products without notice.

• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.

• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.

Head Office And Factory:

• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.

Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454

• Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C

Tel: 886-3-5983621~5 Fax: 886-3-5982931

A

D

F

G

I

K

L

M

3

2

1

C

J

N

E

O

A

B

E

G

I

K

M

O

P

3

2

1

C

N

H

D

Tab

F

J

L

Marking:

Control Code

Date Code

HF

73

Pb Free Mark

Pb-Free: "

Normal: None

IR

0

Note: Green label is used for pb-free packing

Pin Style: 1.Gate 2 & Tab.Drain 3.Source

Material:

• Lead solder plating: Sn60/Pb40 (Normal),

Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)

• Mold Compound: Epoxy resin family,

flammability solid burning class: UL94V-0

3-Lead TO-220AB

Plastic Package

HSMC Package Code: E

DIM

Min.

Max.

A

5.58

7.49

B

8.38

8.90

C

4.40

4.70

D

1.15

1.39

E

0.35

0.60

F

2.03

2.92

G

9.66

10.28

H

-

*16.25

I-

*3.83

J

3.00

4.00

K

0.75

0.95

L

2.54

3.42

M

1.14

1.40

N-

*2.54

O

12.70

14.27

P

14.48

15.87

*: Typical, Unit: mm

Marking:

Control Code

Date Code

HF

73

Pb Free Mark

Pb-Free: "

Normal: None

IR

0F

Note: Green label is used for pb-free packing

Pin Style: 1.Gate 2.Drain 3.Source

Material:

• Lead solder plating: Sn60/Pb40 (Normal),

Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)

• Mold Compound: Epoxy resin family,

flammability solid burning class: UL94V-0

3-Lead TO-220FP

Plastic Package

HSMC Package Code: F

DIM

Min.

Max.

A

6.48

7.40

C

4.40

4.90

D

2.34

3.00

E

0.45

0.80

F

9.80

10.36

G

3.10

3.60

I

2.70

3.43

J

0.60

1.00

K

2.34

2.74

L

12.48

13.60

M

15.67

16.20

N

0.90

1.47

O

2.00

2.96

α1/2/4/5

α3

*: Typical, Unit: mm