DIP39, 54.5x31.0 EP−2

CASE MODGX

ISSUE O

DATE 02 APR 2019

XXXXX = Specific Device Code

ZZZ

= Assembly Lot Code

AT

= Assembly & Test Location

Y

= Year

WW

= Work Week

*This information is generic. Please refer to device data

sheet for actual part marking. Pb−Free indicator, “G” or

microdot “ G”, may or may not be present. Some products

may not follow the Generic Marking.

GENERIC

MARKING DIAGRAM*

XXXXXXXXXXXXXXXXX

ZZZATYWW

MECHANICAL CASE OUTLINE

PACKAGE DIMENSIONS

ON Semiconductor and

are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.

ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding

the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically

disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the

rights of others.

98AON05290H

DOCUMENT NUMBER:

DESCRIPTION:

Electronic versions are uncontrolled except when accessed directly from the Document Repository.

Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.

PAGE 1 OF 1

DIP39, 54.5x31.0 EP−2

© Semiconductor Components Industries, LLC, 2018

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