R1.0 January 9, 2020

www.seoulsemicon.com

Product Data Sheet

SWWVO112E

– WICOP

18

Handling of Silicone Resin for LEDs

(1) During processing, mechanical stress on the surface should be minimized as much as possible.

(2) Sharp objects of all types should not be used to pierce the sealing compound.

(3) At no times should metal tweezers be used to handle the LEDs (Figure 3a).

Also plastic tweezers can be use to handle the LEDs. (Figure 3b)

When handling finished boards containing LED (WICOP series), do not touch the surface of

the LED with fingers or any other material. Do not apply pressure on the top or sides of the LED.

(Figure 3c)

(4) When it is mounted WICOP on the PCB, material of the pick and place nozzle must be used soft

form in SMT.

(5) It must be choosing a pick and place nozzle which is smaller than the WICOP’s size.

(6) (2),(3) contents is necessary in SMT to prevent surface of WICOP

(7) In case WICOP is not recommended isopropyl alcohol and ultrasonic , solvent for cleaning .

Isopropyl alcohol and ultrasonic, solvent cleaning may cause damage to the WICOP

(8) If you want to be cleaning particle on surface of WICOP, Seoul semiconductors suggests using

cotton bud for cleaning after soldering of components

(9) Avoid leaving fingerprints on silicone resin parts.

Figure 3 (a). Incorrect handling of WICOP LEDs

Figure 3 (c). Incorrect handling of WICOP LEDs

Figure 3 (b). correct handling

of WICOP LEDs with plastic tweezers