R1.0 January 9, 2020

www.seoulsemicon.com

Product Data Sheet

SWWVO112E

– WICOP

17

Reflow Soldering Characteristics

(1) Reflow solder conditions / profile

Note : In case that the soldered products are reused in soldering process, we don’t guarantee the products.

Reflow condition

Pb-Free

assembly

2~3℃ / second

150℃

200℃

Min 80 seconds

217~220℃

60~150 seconds

260℃

20~40 seconds

Ramp-down rate

4~6℃ / seconds

Time 25℃ to peak Temperature

6 minutes max

Caution

(1) The reflow cycle is limited to max 2 times.

(2) Re-soldering should not be done after the LEDs have been soldered.

If re-soldering is unavoidable, LED`s characteristics should be carefully checked before and after such repair.

(3) Do not put stress on the LEDs during heating.

(4) After reflow, do not warp the circuit board.

(5) After reflow, do not clean PCB by water or solvent.

(6) We recommend on/off(@0.1~1mA)