Structural Adhesive Film

AF 555

- 2 -

Typical Cured

Physical Properties

Note: The following technical information and data is based on limited 3M testing

conditions and should not be used for specification purposes.

I. Torsion RDA

Test Equipment: Rheometric Dynamic Analyzer

II. Dry / Wet Glass Transition Temperature

Cured Scotch-Weld AF 555 Film dry unconditioned vs. Scotch-Weld AF 555 Film aged in DI water

for 1000 hours at 80°C.

3M™ Scotch-Weld™ Structural Adhesive AF 555 Film unsupported adhesive was cured under standard

conditions. Specimen size: 33.848 (L) x 12.44 (W) x 1.94 mm (T).

Onset Temp

F [C]

Tan Delta Peak

F [C]

Scotch-Weld AF 555 Film

unconditioned

304 [151]

338 [170]

Scotch-Weld AF 555 Film aged

in DI water for 1000 h @ 80°C

279 [137]

325 [163]

136.76°C

151.43°C

162.81°C

169.98°C

0.2

0.4

0.6

0.01

0.1

1

10

100

1

10

100

1000

10000

-50

0

50

100

150

200

250

Temperature (°C)

AF 555 1000h in DIwater 80C.004

–––––––

Copy of AF 555 unconditioned.003

– – – –

Universal V4.3A TA Instruments

Structural Adhesive Film

AF 555

- 3 -

Typical Cured

Physical Properties

(continued)

Note: The following technical information and data is based on limited 3M testing

conditions and should not be used for specification purposes.

III. Metal to Metal – Overlap Shear

Overlap Shear Specimens: 1" wide, 1/2" overlap specimen, 0.063" thick, FPL etched and phosphoric acid

anodized 2024-T3 bare aluminum. Primed with 3M™ Scotch-Weld™ Structural Adhesive Primer EW-5000.

IV. Metal to Metal – Floating Roller Peel

Floating roller peel specimens: 1/2" wide, 0.063" back panel, 0.025" skin 2024-T3 bare aluminum, FPL

etched and phosphoric acid anodized. Primed with 3M™ Scotch-Weld™ Structural Adhesive Primer EW-5000.

Test Temperature

°F (°C)

Scotch-Weld AF 555 Film

M 0.050 Wt. PSI (MPa)

Scotch-Weld AF 555 Film

U 0.030 Wt. PSI (MPa)

Scotch-Weld AF 555 Film

K 0.080 Wt. PSI (MPa)

-67 (-55)

75 (23)

277 (136)

350 (177)

4776 (33)

5416 (37)

2606 (18)

1571 (11)

4850 (33)

5634 (39)

3016 (21)

1526 (11)

4770 (33)

5765 (40)

4355 (30)

2252 (16)

Test Temperature

°F (°C)

Scotch-Weld AF 555 Film

M 0.050 Wt. PIW (N/25mm)

Scotch-Weld AF 555 Film

U 0.030 Wt. PIW (N/25mm)

Scotch-Weld AF 555 Film

K 0.080 Wt. PIW (N/25mm)

-67 (-55)

75 (23)

180 (177)

22 (97)

38 (169)

39 (173)

25 (111)

37 (165)

39 (173)

20 (89)

31 (138)

29 (129)

Scotch-Weld AF 555 Film

0.06M Wt. Supported, Unreticulated

)a

P

M

(

I

S

P

C

°

F

°

)3

.7

(

7

1

1

1

)3

2(

5

7

)4

2.

3(

8

6

4

)6

3

1(

7

7

2

Skin: 0.02" thick 2024-3T bare, FPL etched. Honeycomb Core: 0.50" thick, 1/4" cell, 0.004 foil, 5052 aluminum.

V. Metal to Honeycomb – Flatwise Tensile

All properties were measured on 2" x 2" honeycomb sandwich bonds. Primer used 3M™ Scotch-Weld™

Structural Adhesive Primer EC-3917. Tested in accordance with MIL-A-25463B and ASTM C-297.

Test Temperature