Structural Adhesive Film

AF 555

- 9 -

Typical Cured

Physical Properties

Note: The following technical information and data is based on limited 3M testing

conditions and should not be used for specification purposes.

XV. Out Time: 90°F / 50% RH Exposure

DSC vs. Out Time @ 90°F (32°C) / 50% RH

Samples of 3M™ Scotch-Weld™ Structural Adhesive Film AF 555U 0.035 wt. and AF 555M 0.050 wt.

were conditioned @ 90°F (32°C) / 50% RH for 60 days.

Equipment: Perkin Elmer DSC 7

Ramp Rate: 10°C/min.

Peak Exotherm

Onset Temperature ºF [ºC]

Delta H [J/g]

Temperature ºF [ºC]

initial

315 [157]

289

334 [168]

14 days

315 [157]

296

331 [166]

21 days

313 [156]

280

336 [169]

39 days

313 [156]

302

331 [166]

60 days

311 [155]

290

331 [166]

Scotch-Weld AF 555U Film 0.035 wt. Unsupported

Peak Exotherm

Onset Temperature ºF [ºC]

Delta H [J/g]

Temperature ºF [ºC]

initial

315 [157]

289

340 [171]

14 days

313 [156]

287

336 [169]

21 days

315 [157]

287

336 [169]

39 days

315 [157]

290

336 [169]

60 days

307 [153]

300

331 [166]

Scotch-Weld AF 555M Film 0.05 wt. Supported