8

Solder re-flow recommendation

A recommended soldering profile is shown below. The re-flow profile is based on using specific solder paste

SAC305.

A. Ramp up rate

(25-150 ºC)

B. Pre-heat time

(155-165 ºC)

C. Ramp up (200

ºC - peak)

D. Re-flow time

(above 220 ºC)

E. Peak

temperature

(230-255 ºC)

G. Cooling rate

(peak-25 ºC)

<1.2 °C/s

60-90 sec

<1 °C/s

60-90 sec

230-255 °C

<6 °C/s

A. Ramp up rate

(≈25 to 150 °C): <1.2 °C/s

B. Preheat time

(155 to 165 °C): 60 - 90 sec

E. Peak temp:230 – 255 °C

G. Cooling rate

(peak to ≈25 °C): <6 °C/s

STM32WB5MMG

Solder re-flow recommendation

DS13252 - Rev 1

page 18/31