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AGLP060 датащи(PDF) 20 Page - Actel Corporation

номер детали AGLP060
подробное описание детали  IGLOO PLUS Low Power Flash FPGAs with Flash*Freeze Technology
PDF  128 Pages
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производитель  ACTEL [Actel Corporation]
домашняя страница  http://www.actel.com
Logo ACTEL - Actel Corporation

AGLP060 датащи(HTML) 20 Page - Actel Corporation

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IGLOO PLUS DC and Switching Characteristics
2- 6
R ev isio n 1 1
Thermal Characteristics
Introduction
The temperature variable in the Actel Designer software refers to the junction temperature, not the
ambient temperature. This is an important distinction because dynamic and static power consumption
cause the chip junction temperature to be higher than the ambient temperature.
EQ 1 can be used to calculate junction temperature.
TJ = Junction Temperature = ΔT + TA
EQ 1
where:
TA = Ambient temperature
ΔT = Temperature gradient between junction (silicon) and ambient ΔT = θ
ja * P
θ
ja = Junction-to-ambient of the package. θja numbers are located in Figure 2-5.
P = Power dissipation
Package Thermal Characteristics
The device junction-to-case thermal resistivity is
θ
jc and the junction-to-ambient air thermal resistivity is
θ
ja. The thermal characteristics for θja are shown for two air flow rates. The maximum operating junction
temperature is 100°C. EQ 2 shows a sample calculation of the maximum operating power dissipation
allowed for a 484-pin FBGA package at commercial temperature and in still air.
EQ 2
Temperature and Voltage Derating Factors
Maximum Power Allowed
Max. junction temp. (
°C) Max. ambient temp. (°C)
θ
ja(°C/W)
------------------------------------------------------------------------------------------------------------------------------------------
100
°C70°C
20.5°C/W
-------------------------------------
1.46 W
=
=
=
Table 2-5 • Package Thermal Resistivities
Package Type
Pin
Count
θ
jc
θ
ja
Units
Still Air
200 ft./
min.
500 ft./
min.
Chip Scale Package (CSP)
201
TBD
TBD
TBD
TBD
C/W
281
TBD
TBD
TBD
TBD
C/W
289
TBD
TBD
TBD
TBD
C/W
Very Thin Quad Flat Package (VQFP)
128
TBD
TBD
TBD
TBD
C/W
176
TBD
TBD
TBD
TBD
C/W
Table 2-6 • Temperature and Voltage Derating Factors for Timing Delays (normalized to TJ = 70°C,
VCC =1.425 V)
For IGLOO PLUS V2 or V5 devices, 1.5 V DC Core Supply Voltage
Array Voltage
VCC (V)
Junction Temperature (°C)
–40°C
0°C
25°C
70°C
85°C
100°C
1.425
0.934
0.953
0.971
1.000
1.007
1.013
1.5
0.855
0.874
0.891
0.917
0.924
0.929
1.575
0.799
0.816
0.832
0.857
0.864
0.868



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