FS32K112BHTXMLFTR datasheet(3/100 Pages) NXP

3 / 100 page

Table of Contents

1 Block diagram.................................................................................... 4

2 Feature comparison............................................................................ 5

3 Ordering information......................................................................... 8

3.1 Selecting orderable part number ...............................................8

3.2 Ordering information ................................................................ 9

4 General............................................................................................... 10

4.1 Absolute maximum ratings........................................................10

4.2 Voltage and current operating requirements..............................12

4.3 Thermal operating characteristics..............................................13

4.4 Power and ground pins.............................................................. 15

4.5 LVR, LVD and POR operating requirements............................17

4.6 Power mode transition operating behaviors.............................. 18

4.7 Power consumption................................................................... 20

4.8 ESD handling ratings.................................................................27

4.9 EMC radiated emissions operating behaviors........................... 27

5 I/O parameters....................................................................................28

5.1 AC electrical characteristics...................................................... 28

5.2 General AC specifications......................................................... 28

5.3 DC electrical specifications at 3.3 V Range.............................. 29

5.4 DC electrical specifications at 5.0 V Range.............................. 31

5.5 AC electrical specifications at 3.3 V range .............................. 32

5.6 AC electrical specifications at 5 V range ................................. 33

5.7 Standard input pin capacitance.................................................. 34

5.8 Device clock specifications....................................................... 35

6 Peripheral operating requirements and behaviors.............................. 36

6.1 System modules......................................................................... 36

6.2 Clock interface modules............................................................ 36

6.2.1

External System Oscillator electrical specifications....36

6.2.2

External System Oscillator frequency specifications . 38

6.2.3

System Clock Generation (SCG) specifications.......... 40

6.2.3.1

Fast internal RC Oscillator (FIRC)

electrical specifications............................ 40

6.2.3.2

Slow internal RC oscillator (SIRC)

electrical specifications ........................... 41

6.2.4

Low Power Oscillator (LPO) electrical specifications

......................................................................................41

6.2.5

SPLL electrical specifications .....................................42

6.3 Memory and memory interfaces................................................42

6.3.1

Flash memory module (FTFC/FTFM) electrical

specifications................................................................42

6.3.1.1

Flash timing specifications —

commands................................................ 42

6.3.1.2

Reliability specifications..........................49

6.3.2

QuadSPI AC specifications..........................................49

6.4 Analog modules......................................................................... 54

6.4.1

ADC electrical specifications...................................... 54

6.4.1.1

12-bit ADC operating conditions............. 54

6.4.1.2

12-bit ADC electrical characteristics....... 57

6.4.2

CMP with 8-bit DAC electrical specifications............ 59

6.5 Communication modules........................................................... 65

6.5.1

LPUART electrical specifications............................... 65

6.5.2

LPSPI electrical specifications.................................... 65

6.5.3

LPI2C electrical specifications.................................... 71

6.5.4

FlexCAN electical specifications.................................72

6.5.5

SAI electrical specifications........................................ 72

6.5.6

Ethernet AC specifications.......................................... 74

6.5.7

Clockout frequency......................................................77

6.6 Debug modules.......................................................................... 77

6.6.1

SWD electrical specofications .................................... 77

6.6.2

Trace electrical specifications......................................79

6.6.3

JTAG electrical specifications..................................... 80

7 Thermal attributes.............................................................................. 84

7.1 Description.................................................................................84

7.2 Thermal characteristics..............................................................84

7.3 General notes for specifications at maximum junction

temperature................................................................................ 89

8 Dimensions.........................................................................................90

8.1 Obtaining package dimensions ................................................. 90

9 Pinouts................................................................................................91

9.1 Package pinouts and signal descriptions....................................91

10 Revision History.................................................................................91

S32K1xx Data Sheet, Rev. 12, 02/2020

NXP Semiconductors

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