Epoxy Adhesives

DP110 Translucent and Gray

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Handling/Curing

Information

Directions for Use

1. For high strength structural bonds, paint, oxide films, oils, dust, mold release

agents and all other surface contaminants must be completely removed from

substrates to be bonded. However, the amount of surface preparation necessary

directly depends on the user’s required bond strength, environmental aging

resistance and economic practicalities. For specific surface preparations on

common substrates, see the section on surface preparation.

2. These products consist of two parts.

Mixing

For Duo-Pak Cartridges

3M™ Scotch-Weld™ Epoxy Adhesive DP110 Translucent and Gray are

supplied in a dual syringe plastic duo-pak cartridge as part of the 3M™ EPX™

Applicator system. To use, simply insert the duo-pak cartridge into the EPX

applicator and start the plunger into the cylinders using light pressure on the

trigger. Next, remove the duo-pak cartridge cap and expel a small amount of

adhesive to be sure both sides of the duo-pak cartridge are flowing evenly and

freely. If automatic mixing of Part A and Part B is desired, attach the EPX

mixing nozzle to the duo-pak cartridge and begin dispensing the adhesive. For

hand mixing, expel the desired amount of adhesive and mix thoroughly. Mix

approximately 15 seconds after a uniform color is obtained.

For Bulk Containers

Mix thoroughly by weight or volume in the proportions specified on the product

label or in the uncured properties section. Mix approximately 15 seconds after a

uniform color is obtained.

3. For maximum bond strength apply product evenly to both surfaces to be joined.

4. Application to the substrates should be made within 8 minutes. Larger quantities

and/or higher temperatures will reduce this working time.

5. Join the adhesive coated surfaces and allow to cure at 60°F (16°C) or above until

completely firm. Heat up to 200°F (93°C), will speed curing. These products will

fully cure in 48 hours @ 75°F (24°C).

6. Keep parts from moving during cure. Contact pressure necessary. Maximum shear

strength is obtained with a 3-5 mil bond line.

7. Excess uncured adhesive can be cleaned up with ketone type solvents.*

*Note: When using solvents, extinguish all ignition sources, including pilot lights,

and follow the manufacturer’s precautions and directions for use.

Adhesive Coverage: A 0.005 in. thick bondline will typically yield a coverage of

320 sq. ft./gallon.