DocID030865 Rev 2

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PWD13F60

Suggested footprint

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Suggested footprint

The PWD13F60 footprint for the PCB layout is usually defined based on several design

factors as assembly plant technology capabilities and board component density. For easy

device usage and evaluation, ST provides the following footprint design, which is suitable

for the largest variety of PCBs.

The following footprint indicates the copper area which should be free from the solder mask,

while the copper area shall extend beyond the indicated areas especially for the EPAD1,

EPAD2, EPAD5. To aid thermal dissipation, it is recommended to add thermal vias under

these EPADs to transfer and dissipate device heat to the other PCB copper layers. A PCB

layout example is available with the PWD13F60 evaluation board.

As for the package outline, also the suggested footprint CAD file is available upon request.

Figure 19. Suggested footprint (top view drawing)