334616-001

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List of Figures

Figure 1-1. R200 Module Assembly .......................................................................................... 9

Figure 2-1. Example Color Stream ..........................................................................................10

Figure 2-2. Example Depth Stream .........................................................................................11

Figure 2-3. R200 Module Form Factor......................................................................................11

Figure 2-4. Component Locations (Front View) .........................................................................13

Figure 3-1. Infrared Projector.................................................................................................16

Figure 4-1. Active Stereo Technology Overview ........................................................................19

Figure 6-1. USB Composite Device Hardware ID .......................................................................23

Figure 7-1. Z Direction Module Flex Example............................................................................25

Figure 7-2. Y Direction Module Flex Example ............................................................................26

Figure 7-3. Twist Module Flex Example....................................................................................26

Figure 7-4. Receptacle Ground Bar Motherboard Connections.....................................................28

Figure 7-5. Example IR Transmission of Acceptable Cover Material .............................................30

Figure 7-6. Example of Light Leakage Effects ...........................................................................31

Figure 7-7. Example of Gasket Material Placement....................................................................32

Figure 7-8. Example of Separated Windows for Cover Material ...................................................32

Figure 7-9. System Component Placement...............................................................................33

Figure 7-10. Module Thermal Probe Points ...............................................................................33

Figure 7-11. Module Thermal Solution Chassis or Frame Mount ..................................................35

Figure 7-12. Module Mounting Chassis or Frame .......................................................................35

Figure 7-13. Module Thermal Solution Rear Cover Mount ...........................................................35

Figure 7-14. Module Mounting Rear Cover ...............................................................................36

Figure 7-15. Example of Host Platform Motherboard Routing......................................................37

Figure 7-16. Module Platform Power Gate Example ...................................................................38

Figure 7-17. System Receptacle Properties ..............................................................................38

Figure 9-1. UPC Return Package Values ...................................................................................42

Figure 9-2. PLD System Design Considerations.........................................................................43

Figure 10-1. Camera Module Label..........................................................................................44

Figure 12-1. Cable Mechanical Drawing ...................................................................................47

Figure 13-1. R200 Receptacle Mechanical Drawing....................................................................48

Figure 13-2. R200 Interconnect Plug Mechanical Drawing ..........................................................49