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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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R200 датащи(PDF) 13 Page - Intel Corporation |
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R200 датащи(HTML) 13 Page - Intel Corporation |
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13 / 51 page  Overview 334616-001 13 Figure 2-4. Component Locations (Front View) Note: Module shown without reinforcement frame to expose components. 2.4 Storage and Operating Conditions Table 2-2. Storage and Operating Conditions Condition Description Min Max Unit Storage (Still Air), Not Operating Temperature (Sustained, Controlled )(1) 0 40 oC Temperature (Short Exposure )(2) -40 70 oC Humidity, Non-Condensing 90% RH, 30oC Operating(3) (Still Air) Temperature 0 50 oC NOTES: 1. Controlled conditions should be used for long term storage of product. 2. Short exposure represents temporary max limits acceptable for transportation conditions. 3. Component case temperature limits must be met for all operating temperatures, module performance will degrade at higher temperatures. 2.5 Handling Conditions The R200 has limited ESD protection built into the subassembly. |
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