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2EDF7275K датащи(PDF) 20 Page - Infineon Technologies AG |
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2EDF7275K датащи(HTML) 20 Page - Infineon Technologies AG |
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20 / 38 page ![]() Final datasheet 20 Rev.2.5 2020-03-17 EiceDRIVER™ 2EDi product family 2EDSx reinforced, 2EDFx functional isolated 4A/8A, 1A/2A gate drivers Device characteristics 4.5 Functional and reinforced isolation specifications Each individual part number and package variant has its own safety isolation characteristic due to package dimension and respective isolation test voltages and methods applied. The table heading references each unique part number. For reinforced safety, the regulatory tests described in the component and system standards are applied by Infineon. For functional isolation, the outlined in-house test methods have been applied. As soon as the regulatory certificates are available, the reference and or documents will become available for public download on the Infineon website www.infineon.com/2EDi Note: Final creepage and clearance of component, must be verified in conjunction with PCB design layout and manufacturing choice like PCB material (CTI), stubs, graves, lacquer which might increase or reduce safety distances. Meeting the isolation requirements on system level is therefore the responsibility of the application owner. 4.5.1 Functional isolation specifications 4.5.1.1 Functional isolation of devices in PG-TFLGA-13-1 package The PG-TFLGA-13-1 package is available for 2EDF7275K and 2EDF7235K. The isolation related parameters are shown in Table 18, Table 19 and Table 20; for a component with basic or reinforced safety approval, choose a different part number (e.g. Chapter 4.5.2: 2EDS8265H, 2EDS9265H and 2EDS8165H) Table 18 Functional isolation input-to-output (PG-TFLGA-13-1) Parameter Symbol Values Unit Note or Test Condition Min. Typ. Max. Functional isolation test voltage VIO 1500 – – VDC Impulse test >10 ms, production tested Maximum isolation working voltage VIOWM 460 – – VRMS according to IEC 60664-1 (PD 2; MG II) Package clearance CLR – 3.4 – mm Shortest distance over air, from any input pin to any output pin Package creepage CPG – 3.4 – mm Shortest distance over surface, from any input pin to any output pin Common Mode Transient Immunity CMTI 150 – – V/ns according to DIN V VDE V0884-10, static and dynamic test Capacitance input-to-output CIO –2– pF 1) 1) parameter verified by design, not tested in production Resistance input-to-output RIO – >1000 – MΩ 1) |
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