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SN74HCS20

SCLS791A – MARCH 2020 – REVISED JUNE 2020

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(1)

Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

The input and output voltage ratings may be exceeded if the input and output current ratings are observed. Do not exceed the absolute

maximum voltage supply rating.

(3)

Guaranteed by design.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Supply voltage

–0.5

7

V

0.5

±20

mA

0.5

±20

mA

Continuous output current

±35

mA

±70

mA

150

°C

Storage temperature

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC

±4000

V

Charged-device model (CDM), per JEDEC

±1500

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Supply voltage

2

6

V

Input voltage

0

V

Output voltage

0

V

Δt/Δv

Input transition rise and fall rate

Unlimited

ns/V

Ambient temperature

–40

125

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information

SN74HCS20

UNIT

PW (TSSOP)

D (SOIC)

14 PINS

14 PINS

Junction-to-ambient thermal resistance

151.7

133.6

°C/W

Junction-to-case (top) thermal resistance

79.4

89.0

°C/W

Junction-to-board thermal resistance

94.7

89.5

°C/W

Junction-to-top characterization parameter

25.2

45.5

°C/W

Junction-to-board characterization parameter

94.1

89.1

°C/W

Junction-to-case (bottom) thermal resistance

N/A

N/A

°C/W