SL32-AL THRU SL34-AL

Features

Plastic package has Underwriters Laboratory

Flammability Classification 94V-O Utilizing Flame

Retardant Epoxy Molding Compound.

For surface mounted applications.

Exceeds environmental standards of MIL-S-19500 /

228

Low leakage current.

Mechanical data

Case : Molded plastic, JEDECDO-214AC

Terminals : Solder plated, solderable per MIL-STD-750,

Method 2026

Polarity : Indicated by c athode band

Mounting Position : Any

Weight : 0.0015 ounce, 0.05 gram

(V)

(V)

(V)

(V)

(

SL32-AL

SL32

20

14

20

0.38

SL33-AL

SL33

30

21

30

0.40

SL34-AL

SL34

40

28

40

0.40

SYMBOLS

MARKING

CODE

-55 to +125

Operating

temperature

*1

*2

*3

*4

PARAMETER

CONDITIONS

Symbol

MIN.

TYP.

MAX.

UNIT

Forward rectified current

See Fig.2

3.0

A

Forward surge current

8.3ms single half sine-wave superimposed on

rate load (JEDEC methode)

80

A

25

1.0

mA

10

mA

Thermal resistance

Junction to ambient

50

Diode junction capacitance

f=1MHz and applied 4vDC reverse voltage

300

pF

Storage temperature

-55

+150

Reverse current

*1 Repetitive peak reverse voltage

*2 RMS voltage

*3 Continuous reverse voltage

*4 Maximum forward voltage

Silicon epitaxial planer type

Formosa MS

Low VF Chip Schottky Barrier Diodes

0.205(5.2)

0.189(4.8)

0.012(0.3) Typ.

0.110(2.8)

0.094(2.4)

0.181(4.6)

0.165(4.2)

0.075(1.9)

0.067(1.7)

0.040 (1.0) Typ.

0.040(1.0) Typ.

Dimensions in inches and (millimeters)

SMA-L