Final Datasheet

8

Rev. 1.0

2018-04-04

TLE5014D

Package Information

5

Package Information

The device is qualified with a MSL level of 3. It is halogen free, lead free and RoHS compliant.

5.1

Package Parameters

Figure 5-1 Tolerance of the die in the package

Table 5-1

Package Parameters

Parameter

Symbol Limit Values

Unit

Notes

Min. Typ. Max.

Thermal resistance

120

K/W

chip is active

1) according to Jedec JESD51-7

100

K/W

Junction to air1), both chips

are active

45

K/W

Junction to case

70

K/W

Junction to lead

Moisture Sensitively Level MSL 3

2) suitable for reflow soldering with soldering profiles according to JEDEC J-STD-020E (December 2014)

Lead Frame

Cu

Plating

Sn 100%

> 7 μm

Table 5-2

Position of the die in the package

Parameter

Symbol Limit Values

Unit

Notes

Min. Typ. Max.

Tilt

±3

°

in respect to the z-axis and

reference plane (see

Figure 5-1),

Rotational displacement

±3

°

in respect to the reference

axis (see Figure 5-1)

Placement tolerance in

package

±100 µm

in x and y direction, for each

die in the package

z

Tilt angle

Reference plane

y

x

Rotational

displacement

Package

Chip

x

Die pad

Chip