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TMCS1101

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SBOS825 – SEPTEMBER 2019

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Copyright © 2019, Texas Instruments Incorporated

Feature Description (continued)

9.3.2 Input Isolation

The separation between the input conductor and the Hall sensor die due to the TMCS1101 construction provides

inherent galvanic isolation between package pins 1-4 and pins 5-8. Insulation capability is defined according to

certification agency definitions and using industry-standard test methods as defined in the Insulation

Specifications table. Assessment of device lifetime working voltages follow the VDE 0884-11 standard for basic

insulation, requiring time-dependent dielectric breakdown (TDDB) data-projection failure rates of less than 1000

part per million (ppm), and a minimum insulation lifetime of 20 years. The VDE standard also requires an

additional safety margin of 20% for working voltage, and a 30% margin for insulation lifetime, translating into a

Figure 2 shows the intrinsic capability of the isolation barrier to withstand high-voltage stress over the lifetime of

years. Other factors (such as package size, pollution degree, material group, and so on) can further limit the

working voltage of the component in an end system. The working voltage of the D-8 package is specified up to

Figure 2. Insulation Lifetime

9.3.3 High-Precision Signal Chain

The TMCS1101 uses a precision, low-drift signal chain with proprietary sensor linearization techniques to provide

a highly accurate and stable current measurement across the full temperature range of the device. The device is

fully tested and calibrated at the factory to account for any variations in either silicon or packaging process

variations. The full signal chain provides a fixed sensitivity voltage output that is proportional to the current

through the leadframe of the isolated input.