PNP Transistor Bare Die ‐ BTP981

 

 

 

 

 

General purpose high voltage switch in bare die form

Complement to NPN BTN991

 

Characterized at temperature extremes

 

Silver backside metalization for solder attach

 

Rev 1.0

02/09/17

Features:

Die Dimensions in µm (mils)

Ordering Information:

 

 

 

 

 

The following part suffixes apply:

No suffix - MIL-STD-750 /2072 Visual Inspection

“H” - MIL-STD-750 /2072 Visual Inspection

+ MIL-STD-38534 Class H LAT

“K” - MIL-STD-750 /2072 Visual Inspection

+ MIL-STD-38534 Class K LAT

 

LAT = Lot Acceptance Test.

 

 

For further information on LAT process flows see below.

www.siliconsupplies.com\quality\bare-die-lot-qualification

132

(5.20)

104

(5.20)

B

E

1200 (47.24)

DIE BACK = COLLECTOR

E = EMITTER B = BASE

 

 

Supply Formats:

Mechanical Specification

 

Default – Die in Waffle Pack (400 per tray capacity)

Die Size

(Excluding Saw Street)

1200 x 1200

47.24 x 47.24

µm

mils

 

Sawn Wafer on Tape – Specific request

Unsawn Wafer – Specific request

104 x 132

Base Pad Size

3.94 x 3.94

µm

mils

132 x 116

Emitter Pad Size

 

3.94 x 3.94

With additional electrical selection – Specific request

Die Thickness

230 (±20)

9.06 (±0.79)

µm

mils

Top Metal Composition

 

Sawn as pairs or adjacent pair pick – Specific request

Al

 

Back Metal Composition

Ti/Ni/Ag

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