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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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AM5728 датащи(PDF) 4 Page - Texas Instruments |
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AM5728 датащи(HTML) 4 Page - Texas Instruments |
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4 / 415 page  4 AM5729, AM5728, AM5726 SPRS953F – DECEMBER 2015 – REVISED MAY 2019 www.ti.com Submit Documentation Feedback Product Folder Links: AM5729 AM5728 AM5726 Table of Contents Copyright © 2015–2019, Texas Instruments Incorporated Table of Contents 1 Device Overview ......................................... 1 1.1 Features .............................................. 1 1.2 Applications ........................................... 2 1.3 Description ............................................ 2 1.4 Functional Block Diagram ........................... 3 2 Revision History ......................................... 5 3 Device Comparison ..................................... 6 3.1 Related Products ..................................... 8 4 Terminal Configuration and Functions .............. 9 4.1 Terminal Assignment ................................. 9 4.2 Ball Characteristics .................................. 10 4.3 Multiplexing Characteristics ......................... 89 4.4 Signal Descriptions ................................ 109 5 Specifications ......................................... 157 5.1 Absolute Maximum Ratings ........................ 157 5.2 ESD Ratings ....................................... 158 5.3 Power on Hours (POH) Limits ..................... 159 5.4 Recommended Operating Conditions ............. 160 5.5 Operating Performance Points ..................... 163 5.6 Power Consumption Summary .................... 182 5.7 Electrical Characteristics ........................... 182 5.8 Thermal Characteristics ............................ 190 5.9 Power Supply Sequences ......................... 192 6 Clock Specifications ................................. 197 6.1 Input Clock Specifications ......................... 198 6.2 RC On-die Oscillator Clock ........................ 206 6.3 DPLLs, DLLs Specifications ....................... 207 7 Timing Requirements and Switching Characteristics ........................................ 211 7.1 Timing Test Conditions ............................ 211 7.2 Interface Clock Specifications ..................... 211 7.3 Timing Parameters and Information ............... 211 7.4 Recommended Clock and Control Signal Transition Behavior ............................................ 213 7.5 Virtual and Manual I/O Timing Modes ............. 213 7.6 Video Input Ports (VIP) ............................ 216 7.7 Display Subsystem – Video Output Ports ......... 234 7.8 Display Subsystem – High-Definition Multimedia Interface (HDMI) ................................... 246 7.9 External Memory Interface (EMIF) ................. 246 7.10 General-Purpose Memory Controller (GPMC) ..... 246 7.11 Timers .............................................. 268 7.12 Inter-Integrated Circuit Interface (I2C) ............. 269 7.13 HDQ / 1-Wire Interface (HDQ1W) ................. 272 7.14 Universal Asynchronous Receiver Transmitter (UART) ............................................. 274 7.15 Multichannel Serial Peripheral Interface (McSPI) . 275 7.16 Quad Serial Peripheral Interface (QSPI) .......... 281 7.17 Multichannel Audio Serial Port (McASP) .......... 286 7.18 Universal Serial Bus (USB) ........................ 305 7.19 Serial Advanced Technology Attachment (SATA) . 305 7.20 Peripheral Component Interconnect Express (PCIe) .............................................. 305 7.21 Controller Area Network Interface (DCAN) ........ 306 7.22 Ethernet Interface (GMAC_SW) ................... 307 7.23 eMMC/SD/SDIO ................................... 318 7.24 General-Purpose Interface (GPIO) ................ 344 7.25 Programmable Real-Time Unit Subsystem and Industrial Communication Subsystem (PRU-ICSS) 345 7.26 System and Miscellaneous interfaces ............. 371 7.27 Test Interfaces ..................................... 371 8 Applications, Implementation, and Layout ...... 375 8.1 Power Supply Mapping ............................ 375 8.2 DDR3 Board Design and Layout Guidelines ....... 376 8.3 High Speed Differential Signal Routing Guidance . 399 8.4 Power Distribution Network Implementation Guidance ........................................... 399 8.5 Thermal Solution Guidance ........................ 399 8.6 Single-Ended Interfaces ........................... 399 8.7 LJCB_REFN/P Connections ....................... 401 8.8 Clock Routing Guidelines .......................... 402 9 Device and Documentation Support .............. 404 9.1 Device Nomenclature .............................. 404 9.2 Tools and Software ................................ 406 9.3 Documentation Support ............................ 407 9.4 Related Links ...................................... 407 9.5 Community Resources ............................. 407 9.6 Trademarks ........................................ 407 9.7 Electrostatic Discharge Caution ................... 408 9.8 Glossary ............................................ 408 10 Mechanical, Packaging, and Orderable Information ............................................. 409 10.1 Packaging Information ............................. 409 |
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