Data sheet

BMP183

Page 26

BST-BMP183-DS000-00 | Revision 1.0 | June 2012

Bosch Sensortec

© Bosch Sensortec GmbH reserves all rights even in the event of industrial property rights. We reserve all rights of disposal such as copying and passing on to third

parties. BOSCH and the symbol are registered trademarks of Robert Bosch GmbH, Germany.

Note: Specifications within this document are subject to change without notice.

6.3 Moisture sensitivity level and soldering

The BMP183 is classified MSL 1 (moisture sensitivity level) according to IPC/JEDEC standards J-

STD-020D and J-STD-033A.

The device can be soldered Pb-free with a peak temperature of 260°C for 20 to 40 sec. The

minimum height of the solder after reflow shall be at least 50µm. This is required for good

mechanical decoupling between the sensor device and the printed circuit board (PCB).

To ensure good solder-ability, the devices shall be stored at room temperature (20°C).

The soldering process can lead to an offset shift.

6.4 RoHS compliancy

The BMP183 sensor meets the requirements of the EC directive "Restriction of hazardous

substances (RoHS)", please refer also to:

"Directive 2002/95/EC of the European Parliament and of the Council of 27 January 2003 on the

restriction of the use of certain hazardous substances in electrical and electronic equipment".

The BMP183 sensor is also halogen-free.

6.5 Mounting and assembly recommendations

In order to achieve the specified performance for you design, the following recommendations and the

“Handling, soldering & mounting instructions BMP183” should be taken into consideration when

mounting a pressure sensor on a printed-circuit board (PCB):

 The clearance above the metal lid shall be 0.1mm at minimum.

 For the device housing appropriate venting needs to be provided in case the ambient

pressure shall be measured.

 Liquids shall not come into direct contact with the device.

 During operation the sensor is sensitive to light, which can influence the accuracy of the

measurement (photo-current of silicon).

 The BMP183 shall not the placed close the fast heating parts. In case of gradients > 3°C/sec.

it is recommended to follow Bosch Sensortec application note ANP015, "Correction of errors

induced by fast temperature changes". Please contact your Bosch Sensortec representative

for details.