BK2425

Revision 1.0

Proprietary and Confidential

Page 2 of 30

Table of Contents

1

 

General Description ................................................................................................................. 3

 

2

 

Abbreviations .......................................................................................................................... 4

 

3

 

Pin Information ....................................................................................................................... 5

 

4

 

State Control ........................................................................................................................... 6

 

4.1

  State Control Diagram............................................................................................................... 6 

4.2

  Power Down Mode.................................................................................................................... 7 

4.3

  Standby-I Mode......................................................................................................................... 7 

4.4

  Standby-II Mode........................................................................................................................ 7 

4.5

  TX Mode ................................................................................................................................... 7 

4.6

  RX Mode ................................................................................................................................... 8 

5

 

Packet Processing .................................................................................................................... 8

 

5.1

  Packet Format............................................................................................................................ 8 

5.1.1

  Preamble........................................................................................................................... 9 

5.1.2

  Address............................................................................................................................. 9 

5.1.3

  Packet Control.................................................................................................................. 9 

5.1.4

  Payload........................................................................................................................... 10 

5.1.5

  CRC................................................................................................................................ 10 

5.2

  Packet Handling ...................................................................................................................... 10 

6

 

Data and Control Interface .................................................................................................... 11

 

6.1

  TX/RX FIFO ........................................................................................................................... 11 

6.2

  Interrupt................................................................................................................................... 11 

6.3

  SPI Interface............................................................................................................................ 12 

6.3.1

  SPI Command ................................................................................................................ 12 

6.3.2

  SPI Timing ..................................................................................................................... 13 

7

 

Register Map ......................................................................................................................... 15

 

7.1

  Register Bank 0 ....................................................................................................................... 15 

7.2

  Register Bank 1 ....................................................................................................................... 21 

8

 

Electrical Specifications ......................................................................................................... 22

 

9

 

Typical Application Schematic............................................................................................... 23

 

10

10.1

 

Package Information ........................................................................................................... 24

 

10.2

 

Die Bonding Information .................................................................................................... 25

 

10.3

 

PCB Bonding diagram ........................................................................................................ 27

 

11

12

13