© 2006 Fairchild Semiconductor Corporation

www.fairchildsemi.com

FXLP34 • Rev. 1.0.4

11

Physical Dimensions

1.00

B. DIMENSIONS ARE IN MILLIMETERS.

C. DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994

NOTES:

A. COMPLIES TO JEDEC MO-252 STANDARD

0.05 C

A

B

0.55MAX

0.05 C

C

0.35

0.09

0.19

12

3

0.35

0.25

5X

6X

DETAIL A

0.60

(0.08)

4X

(0.05) 6X

0.40

0.30

0.075X45°

CHAMFER

5X 0.40

0.35

1X 0.45

6X 0.19

TOP VIEW

BOTTOM VIEW

0.66

0.10

CB A

.05 C

0.89

PIN 1

0.05 C

2X

2X

1.00

D. LANDPATTERN RECOMMENDATION IS BASED ON FSC

E. DRAWING FILENAME AND REVISION: MGF06AREV3

0.52

0.73

0.57

0.20 6X

1X

5X

RECOMMENDED LAND PATTERN

FOR SPACE CONSTRAINED PCB

DETAIL A

PIN 1 LEAD SCALE: 2X

ALTERNATIVE LAND PATTERN

FOR UNIVERSAL APPLICATION

DESIGN.

0.90

MIN 250uM

65

4

0.35

(0.08) 4X

SIDE VIEW

Figure 7.

6-Lead, MicroPak2™, 1x1mm Body, .35mm Pitch

Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner

without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or

obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the

warranty therein, which covers Fairchild products.

Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:

Tape and Reel Specification

Please visit Fairchild Semiconductor’s online packaging area for the most recent tape and reel specifications:

http://www.fairchildsemi.com/packaging/MicroPAK2_6L_tr.pdf.

Package Designator

Tape Section

Cavity Number

Cavity Status

Cover Type Status

FHX

Leader (Start End)

125 (Typical)

Empty

Sealed

Carrier

5000

Filled

Sealed

Trailer (Hub End)

75 (Typical)

Empty

Sealed