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ATSAM3103 датащи(PDF) 20 Page - ATMEL Corporation

номер детали ATSAM3103
подробное описание детали  ATSAM3103 VERSATILE LOW-POWER AUDIO DSP/LOW-COST EFFECTS DSP
PDF  24 Pages
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производитель  ATMEL [ATMEL Corporation]
домашняя страница  http://www.atmel.com
Logo ATMEL - ATMEL Corporation

ATSAM3103 датащи(HTML) 20 Page - ATMEL Corporation

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ATSAM3103
6093A–DRMSD–25-Oct-04
Recommended
Board Layout
Like all HCMOS high integration ICs, the following simple rules of board layout are man-
datory for reliable operation:
GND, VC33, VC18 Distribution and Decouplings
All GND, VC33, VC18 pins should be connected. A GND plane is strongly recom-
mended. The board GND + VC33 distribution should be in grid form.
Recommended VC18 decoupling is 0.1 µF at each corner of the IC with an additional 10
µF decoupling close to the crystal. VC33 requires a single 0.1µF decoupling.
Crystal, LFT
The paths between the crystal, the crystal compensation capacitors, the LFT filter R-C-
R and the ATSAM3103 should be short and shielded. The ground return from the com-
pensation capacitors and LFT filter should be the GND plane from ATSAM3103.
Buses
A ground plane should be implemented below the D0 - D7 bus, which is connected to
the host and to the ATSAM3103 GND.
A ground plane should be implemented below the WA0 - WA21/WD0 - WD15 bus,
which is connected to the ROM/Flash grounds and to the ATSAM3103.
Analog Section
A specific AGND ground plane should be provided, which is connected to the GND
ground by a single trace. No digital signals should cross the AGND plane.
Refer to the Codec vendor recommended layout for correct implementation of the ana-
log section.



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