DA1641.004

1 February, 2019

13 (14)

QFN-16 3X3x0.75 PCB LAND PATTERN

Notes

•

I/O lands should be 0.2mm longer than QFN pads and extend the same 0.2mm outside package outline

•

exposed pad land size should be the same as QFN exposed pad size

•

solder resist opening should be 120

m…150m larger than the land size resulting in 60m…75m

clearance between copper land and solder resist