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AP8803 датащи(PDF) 3 Page - Diodes Incorporated

номер детали AP8803
подробное описание детали  30V 1A BUCK LED DRIVER
PDF  10 Pages
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производитель  DIODES [Diodes Incorporated]
домашняя страница  http://www.diodes.com
Logo DIODES - Diodes Incorporated

AP8803 датащи(HTML) 3 Page - Diodes Incorporated

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AP8803
Document number: DS31970 Rev. 5 - 2
3 of 10
www.diodes.com
August 2012
© Diodes Incorporated
AP8803
Recommended Operating Conditions (@TA = +25°C, unless otherwise specified.)
Symbol
Parameter
Min
Max
Unit
VIN
Operating Input Voltage
8.0
30
V
VCTRLH
Voltage High
0.3
2.5
V
VCTRLL
Voltage Low
0.25
V
ISW
Continuous Switch Current (Note 5)
1
A
TA
Ambient Temperature Range
-40
+125
°C
Duty Cycle
Using Inductor
≥ 100µH (Note 4)
0.1
0.95
Notes:
4. For most applications the LED current will be within 8% over the duty cycle range specified. Duty cycle accuracy is also dependent on
propagation delay. Smaller size inductors can be used but LED current accuracy may be greater than 8% at extremes of duty cycle. This is
most noticeable at low duty cycles (less than 0.1) or when the input voltage is high and only one LED is being driven.
5. Refer to Figure 8 for the device derating curve.
Electrical Characteristics (@TA = +25°C, unless otherwise specified.)
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VINSU
Internal Regulator Start-Up Threshold
VIN rising
5.65
V
VINSD
Internal Regulator Shutdown Threshold VIN falling
5.55
V
IQ
Quiescent Current
CTRL pin floating f = 250kHz
1.8
5
mA
VTHD
Internal Threshold Voltage
92
100
108
mV
ISET
SET Pin Input Current
VSET = VIN -0.1
1.25
10
µA
VREF
Internal Reference Voltage
1.25
V
RDS(on)
On Resistance of MOSFET
ISW = 1A
0.5
1
Ω
ISW
Continuous Switch Current
(Note 5)
1
A
ISW_Leakage
Switch Leakage Current
8
µA
fOSC
Switching Frequency
0.7
MHz
θ
JA
Thermal Resistance Junction-to-
Ambient
TSOT25 (Note 6)
125
°C/W
Notes:
5. Refer to Figure 8 for the device derating curve.
6. Test condition for TSOT25: Device mounted on FR-4 PCB, 25mm x 25mm, 2oz copper, minimum recommended pad layout on top layer and
thermal vias to bottom layer ground plane. For better thermal performance, larger copper pad for heat-sink is needed.



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