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AP8803 датащи(PDF) 2 Page - Diodes Incorporated |
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AP8803 датащи(HTML) 2 Page - Diodes Incorporated |
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2 / 10 page ![]() AP8803 Document number: DS31970 Rev. 5 - 2 2 of 10 www.diodes.com August 2012 © Diodes Incorporated AP8803 Pin Descriptions Pin Name Function SW Switch Pin. Connect inductor/freewheeling diode here, minimizing track length at this pin to reduce EMI. GND GND pin SET Set Nominal Output Current Pin. Configure the output current of the device. CTRL Dimming and On/Off Control Input. • Leave floating for normal operation. (VCTRL = VREF = 1.25V giving nominal average output current IOUTnom = 0.1/RS) • Drive to voltage below 0.2V to turn off output current • Drive with DC voltage (0.3V < VCTRL < 1.25V) to adjust output current from 25% to 100% of IOUTnom • Input voltage of 0.2V or lower forces the device into low current standby mode and shuts off the output. A PWM signal allows the output current to be adjusted above or below the level set by the resistor connected to SET input pin. VIN Input Supply Pin. Must be locally decoupled to GND with > 2.2µF X7R ceramic capacitor. Functional Block Diagram Absolute Maximum Ratings (@TA = +25°C, unless otherwise specified.) Symbol Parameter Rating Unit VIN Continuous VIN pin voltage -0.3 to +30 V Transient (t < 0.5s) 40 VSW SW voltage -0.3 to +30 V Transient (t < 0.5s) 40 VCTRL CTRL pin input voltage -0.3 to +6 V ISW Switch current 1.25 A ESDHBM Human Body Model ESD 500 V ESDMM Machine Model ESD <100 V TJ Junction Temperature 150 °C TLEAD Lead Temperature Soldering 300 °C TST Storage Temperature Range -65 to +150 °C Caution: Stresses greater than the 'Absolute Maximum Ratings' specified above, may cause permanent damage to the device. These are stress ratings only; functional operation of the device at these or any other conditions exceeding those indicated in this specification is not implied. Device reliability may be affected by exposure to absolute maximum rating conditions for extended periods of time. Semiconductor devices are ESD sensitive and may be damaged by exposure to ESD events. Suitable ESD precautions should be taken when handling and transporting these devices |
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