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PCA9511ADP датащи(PDF) 21 Page - NXP Semiconductors

номер детали PCA9511ADP
подробное описание детали  Hot swappable I2C-bus and SMBus bus buffer
PDF  23 Pages
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производитель  PHILIPS [NXP Semiconductors]
домашняя страница  http://www.nxp.com
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PCA9511ADP датащи(HTML) 21 Page - NXP Semiconductors

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9397 750 13269
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 01 — 15 August 2005
21 of 23
Philips Semiconductors
PCA9511A
Hot swappable I2C-bus and SMBus bus buffer
[4]
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.
[5]
If wave soldering is considered, then the package must be placed at a 45
° angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
[6]
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
[7]
Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger
than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
[8]
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by
using a hot bar soldering process. The appropriate soldering profile can be provided on request.
[9]
Hot bar soldering or manual soldering is suitable for PMFP packages.
15. Abbreviations
16. Revision history
Table 7:
Abbreviations
Acronym
Description
AdvancedTCA
Advanced Telecommunications Computing Architecture
CDM
Charged Device Model
cPCI
compact Peripheral Component Interface
ESD
Electrostatic Discharge
HBM
Human Body Model
I2C-bus
Inter IC bus
MM
Machine Model
PCI
Peripheral Component Interface
PICMG
PCI Industrial Computer Manufacturers Group
SMBus
System Management Bus
VME
VERSAModule Eurocard
Table 8:
Revision history
Document ID
Release date
Data sheet status
Change notice
Doc. number
Supersedes
PCA9511A_1
20050815
Product data sheet
-
9397 750 13269
-



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