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AD9735BBCZ датащи(PDF) 69 Page - Analog Devices

номер детали AD9735BBCZ
подробное описание детали  1200 MSPS DACS
PDF  72 Pages
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производитель  AD [Analog Devices]
домашняя страница  http://www.analog.com
Logo AD - Analog Devices

AD9735BBCZ датащи(HTML) 69 Page - Analog Devices

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Data Sheet
AD9734/AD9735/AD9736
Rev. B | Page 69 of 72
OUTLINE DIMENSIONS
12.10
12.00 SQ
11.90
SEATING
PLANE
0.43 MAX
0.25 MIN
DETAIL A
0.55
0.50
0.45
0.12 MAX
COPLANARITY
1.00 MAX
0.85 MIN
BALL DIAMETER
0.80 BSC
0.80
REF
10.40
BSC SQ
A
B
C
D
E
F
G
H
J
K
L
M
N
P
14
13
12
11
10
8
7
6
3
2
1
9
5
4
A1 CORNER
INDEX AREA
TOP VIEW
BALL A1
INDICATOR
DETAIL A
BOTTOM
VIEW
1.40 MAX
COMPLIANT TO JEDEC STANDARDS MO-205-AE.
Figure 116. 160-Lead Chip Scale Package Ball Grid Array [CSP_BGA]
(BC-160-1)
Dimensions shown in millimeters
ORDERING GUIDE
Model1
Temperature Range
Package Description
Package Option
AD9734BBCRL
−40°C to +85°C
160-Lead Chip Scale Package Ball Grid Array (CSP_BGA)
BC-160-1
AD9734BBCZ
−40°C to +85°C
160-Lead Chip Scale Package Ball Grid Array (CSP_BGA)
BC-160-1
AD9734BBCZRL
−40°C to +85°C
160-Lead Chip Scale Package Ball Grid Array (CSP_BGA)
BC-160-1
AD9735BBCZ
−40°C to +85°C
160-Lead Chip Scale Package Ball Grid Array (CSP_BGA)
BC-160-1
AD9735BBCZRL
−40°C to +85°C
160-Lead Chip Scale Package Ball Grid Array (CSP_BGA)
BC-160-1
AD9736BBC
−40°C to +85°C
160-Lead Chip Scale Package Ball Grid Array (CSP_BGA)
BC-160-1
AD9736BBCRL
−40°C to +85°C
160-Lead Chip Scale Package Ball Grid Array (CSP_BGA)
BC-160-1
AD9736BBCZ
−40°C to +85°C
160-Lead Chip Scale Package Ball Grid Array (CSP_BGA)
BC-160-1
AD9736BBCZRL
−40°C to +85°C
160-Lead Chip Scale Package Ball Grid Array (CSP_BGA)
BC-160-1
AD9734-DPG2-EBZ
Evaluation Board
AD9735-DPG2-EBZ
Evaluation Board
AD9736-DPG2-EBZ
Evaluation Board
1 Z = RoHS Compliant Part.



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