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AM6548 датащи(PDF) 131 Page - Texas Instruments |
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AM6548 датащи(HTML) 131 Page - Texas Instruments |
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131 / 299 page ![]() 131 AM6548, AM6528, AM6546 AM6526, AM6527 www.ti.com SPRSP08E – NOVEMBER 2017 – REVISED OCTOBER 2018 Submit Documentation Feedback Product Folder Links: AM6548 AM6528 AM6546 AM6526 AM6527 Specifications Copyright © 2017–2018, Texas Instruments Incorporated 5.9 Thermal Resistance Characteristics This section provides the thermal resistance characteristics used on this device. For reliability and operability concerns, the maximum junction temperature of the Device has to be at or below the TJ value identified in Section 5.4, Recommended Operating Conditions. 5.10 Thermal Resistance Characterstics It is recommended to perform thermal simulations at the system level with the worst case device power consumption. NO. NAME DESCRIPTION ACD °C/W AIR FLOW (m/s) T1 RΘJC Junction-to-case 0.2 N/A T2 RΘJB Junction-to-board 3.1 N/A T3 RΘJA Junction-to-free air 12.8 0 T4 Junction-to-moving air 7.4 1 T5 6.5 2 T6 6 3 T7 ΨJT Junction-to-package top 0.1 0 T8 0.1 1 T9 0.1 2 T10 0.1 3 T11 ΨJB Junction-to-board 2.9 0 T12 2.4 1 T13 2.3 2 T14 2.3 3 (1) These values are based on a JEDEC defined 2S2P system (with the exception of the Theta JC [RΘJC] value, which is based on a JEDEC defined 1S0P system) and will change based on environment as well as application. For more information, see these EIA/JEDEC standards: – JESD51-2, Integrated Circuits Thermal Test Method Environment Conditions - Natural Convection (Still Air) – JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages – JESD51-6, Integrated Circuit Thermal Test Method Environmental Conditions - Forced Convection (Moving Air) – JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages – JESD51-9, Test Boards for Area Array Surface Mount Packages (2) m/s = meters per second. (3) °C/W = degrees Celsius per watt. |
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