AD9543 datasheet(21/66 Pages) AD

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Data Sheet

AD9543

Rev. 0 | Page 21 of 66

ABSOLUTE MAXIMUM RATINGS

Table 24.

Parameter

Rating

1.8 V Supply Voltage (VDD)

2 V

Input/Output Supply Voltage

(VDDIOA, VDDIOB)

3.6 V

Input Voltage Range (XOA, XOB,

REFA, REFAA, REFB, REFBB)

−0.5 V to VDD + 0.5 V

Digital Input Voltage Range

SDO/M5, SCLK/SCL, SDIO/SDA,

CSB/M6

−0.5 V to VDDIOA + 0.5 V

M0, M1, M2, M3, M4

−0.5 V to VDDIOB + 0.5 V

Storage Temperature Range

−65°C to +150°C

Operating Temperature Range1

−40°C to +85°C

Lead Temperature (Soldering 10 sec)

300°C

1 See the Thermal Resistance section for additional information.

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to

PCB thermal design is required.

θJA is the junction to ambient thermal resistance, 0.0 m/sec

airflow per JEDEC JESD51-2 (still air).

θJMA is the junction to ambient thermal resistance, 1.0 m/sec

airflow or 2.5 m/sec airflow per JEDEC JESD51-6 (moving air).

θJC is the junction to case thermal resistance (die to heat sink)

per MIL-STD 883, Method 1012.1

Values of θJA are for package comparison and PCB design

considerations. θJA provides for a first-order approximation of TJ

per the following equation:

TJ = TA + (θJA × PD)

where TA is the ambient temperature (°C).

Values of θJC are for package comparison and PCB design

considerations when an external heat sink is required.

Table 25. Thermal Resistance

Package Type

θJA

θJMA1

θJC

Unit

CP-48-132, 3

23.9

19.4, 18.2

1.5

°C/W

1 θJMA is 19.4°C/W at 1.0 m/sec airflow, and 18.2°C/W at 2.5 m/sec airflow.

2 Thermal characteristics derived using a JEDEC51.7 plus JEDEC51-5 2S2P test

board. The exposed pad on the bottom of the package must be soldered to

ground to achieve the specified thermal performance.

3 Results are from simulations. The PCB is a JEDEC multilayer type. Thermal

performance for actual applications requires careful inspection of the

conditions in the application to determine if they are similar to those

assumed in these calculations.

ESD CAUTION

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