SCM1271MF datasheet(22/53 Pages) SANKEN

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SCM1270MF Series

SCM1270MF-DSE Rev.1.4

SANKEN ELECTRIC CO., LTD.

Aug. 9, 2018

http://www.sanken-ele.co.jp/en

circuit with a built-

in 22 kΩ pull-down resistor, and its

input logic is active high.

Input signals across the HINx–COMx and the

LINx–COMx pins in each phase should be set within the

ranges provided in Table 12-1, below. Note that dead

time setting must be done for HINx and LINx signals

because the IC does not have a dead time generator.

The higher PWM carrier frequency rises, the more

switching loss increases. Hence, the PWM carrier

frequency must be set

so that operational case

temperatures and junction temperatures have sufficient

margins against the absolute maximum ranges, specified

in Section 1.

If the signals from the microcontroller become

unstable, the IC may result in malfunctions. To avoid

this event, the outputs from the microcontroller output

line should not be high impedance. Also, if the traces

from the microcontroller to the HINx or LINx pin (or

both) are too long, the traces may be interfered by noise.

Therefore, it is recommended to add an additional filter

or a pull-down resistor near the HINx or LINx pin as

needed (see Figure 12-6).

Here are filter circuit constants for reference:

- RIN1x: 33

Ω to 100 Ω

- RIN2x: 1

kΩ to 10 kΩ

- CINx: 100 pF to 1000 pF

Care should be taken when adding RIN1x and RIN2x to

the traces. When they are connected each other, the

input voltage of the HINx and LINx pins becomes

slightly

lower

than

the

output

voltage

the

microcontroller.

Table 12-1.

Input Signals for HINx and LINx Pins

Parameter

High Level Signal

Low Level Signal

Input Voltage

3 V < VIN < 5.5 V

0 V < VIN < 0.5 V

Input Pulse

Width

≥0.5 μs

PWM Carrier

Frequency

≤20 kHz

Dead Time

≥1.5 μs

HINx

(LINx)

COMx

5 V

2 k

22 k

Figure 12-5.

Internal Circuit Diagram of HINx or

LINx Pin

RIN1

RIN2

CIN

Input

signal

Controller

HINx

(LINx)

SCM1270MF

Figure 12-6.

Filter Circuit for HINx or LINx Pin

12.2.7. VBB

This is the input pin for the main supply voltage, i.e.,

the positive DC bus. All of the IGBT collectors of the

high-side are connected to this pin. Voltages between

the VBB and COMx pins should be set within the

recommended range of the main supply voltage, VDC,

given in Section 2. To suppress surge voltages, put a

0.01 μF to 0.1 μF bypass capacitor, C

S, near the VBB

pin and an electrolytic capacitor, CDC, with a minimal

length of PCB traces to the VBB pin.

12.2.8. LS1, LS2, and LS3

These are the emitter pins of the low-side IGBTs. For

current detection, the LS1, LS2, and LS3 pins should be

connected externally on a PCB via a shunt resistor, RS,

to the COMx pin. Otherwise, malfunction may occur

because a longer circuit trace increases its inductance

and thus increases

its

susceptibility to improper

operations. In applications where long PCB traces are

required, add a fast recovery diode, DRS, between the

LSx and COMx pins in order to prevent the IC from

malfunctioning.

COM1

VBB

LS3

LS2

LS1

COM2

COM3

VDC

CDC

Put a shunt resistor near

the IC with a minimum

length to the LSx pin.

Add a fast recovery

diode to a long trace.

DRS

OCP1,

OCP3

Figure 12-7.

Connections to LSx Pin

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