NXP Semiconductors

BGS8H2

SiGe:C low-noise amplifier MMIC with bypass switch for LTE

BGS8H2

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Product data sheet

Rev. 3 — 29 June 2018

COMPANY CONFIDENTIAL

11 / 15

14 Package outline

References

Outline

version

European

projection

Issue date

IEC

JEDEC

JEITA

SOT1232

sot1232_po

13-04-12

13-11-08

Unit

mm

min

nom

max

1.05

0.1 0.05

A

Dimensions (mm are the original dimensions)

Note

1. Dimension A is including plating thickness.

SOT1232

D

0.65

0.4

E

L

V

Y

0.40 0.04

0.34

1.10 0.4

0.70

0.37

1.15

0.75

0.1

0.17

0.25

e

b

0.17

0.20

0.20

0.25

pin 1

index area

pin 1

index area

(4×)

D

A

E

B

C

(6×)

v

A B

L

(6×)

v

A B

b

e

(6×)

1

3

6

4

scale

0

1 mm

XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1.1 x 0.7 x 0.37 mm

A

y

C

Figure 4. Package outline SOT1232 (XSON6)