ZL2103

FN6966 Rev 5.00

Page 4 of 28

May 3, 2011

31

VR

PWR

Regulated bias from internal 7V low-dropout regulator (return is PGND). Decouple with a 4.7µF capacitor to

PGND.

32

VRA

PWR

Regulated bias from internal 5V low-dropout regulator for internal analog circuitry (return is SGND).

Decouple with a 4.7µF capacitor to SGND.

33

V2P5

PWR

Regulated bias from internal 2.5V low-dropout regulator for internal digital circuitry (return is DGND).

Decouple with a 10µF capacitor.

34

DDC

I/O

Digital-DC Bus (open drain). Interoperability between Zilker Labs devices.

35

MGN

I

Margin pin. Used to enable margining of the output voltage.

36

EN

I

Enable pin. Used to enable the device (active high).

ePad

SGND

PWR

Exposed thermal pad. Common return for analog signals. Connect to low impedance ground plane.

NOTES:

1. I = Input, O = Output, PWR = Power or Ground, M = Multi-mode pins. Please refer to Section “Multi-mode Pins” on page 12.

2. The SYNC pin can be used as a logic pin, a clock input or a clock output.

PIN

LABEL

TYPE

(Note 1)

DESCRIPTION

Ordering Information

PART NUMBER

(Notes 4, 5)

PART

MARKING

TEMP RANGE

(°C)

PACKAGE

(Pb-free)

PKG.

DWG. #

ZL2103ALAF

2103

-40 to +85

36 Ld 6mmx6mm QFN

L36.6x6C

ZL2103ALAFT (Note 3)

2103

-40 to +85

36 Ld 6mmx6mm QFN

L36.6x6C

ZL2103ALAFTK (Note 3)

2103

-40 to +85

36 Ld 6mmx6mm QFN

L36.6x6C

ZL2103EVAL1Z

Evaluation Board

NOTES:

3. Please refer to TB347 for details on reel specifications.

4. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte

tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil

Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.

5. For Moisture Sensitivity Level (MSL), please see device information page for ZL2103. For more information on MSL please see techbrief TB363.